Electronics(PCB) plating
What is PCB Electronics Plating
Electronic plating is a core manufacturing technology for microelectronics and printed circuit boards (PCB). It deposits uniform metal layers (copper, gold and other precious metals) onto substrates, circuit traces and through-holes, to realize electrical connectivity, corrosion resistance and surface protection.
Compared with conventional decorative plating, PCB plating demands ultra-high precision in coating uniformity, thickness consistency and process stability, to satisfy the strict requirements of microelectronic devices, PCBs and semiconductor components.
Typical application conditions and product recommendation
Through long-term research and development, our company has accumulated practical experience in producing high-quality anode products required for PCB circuit boards under harsh working conditions. Our company works closely with our customers to design and manufacture anode products suitable for various PCB electroplating processes, including: reverse pulse copper plating process in PCB manufacturing, DC copper plating in PCB manufacturing, gold plating process in PCB manufacturing, semiconductor component electroplating and precious metal electronic plating……
| Process | Electrolyte | Temperature | Current Density | Anode Type |
| Vertical Continuous DC Copper Plating | CuSO4·5H2O: 200–240 g/L; H2SO4: 80–100 g/L; Cl-: 40–55 ppm; Additives | 20–70 °C | 100–500 A/m² (DC) | Titanium anode coated with modified Ir-Ta mixed metal oxide (ensures low additive consumption) |
| Circuit Board Reverse Pulse Copper Plating | CuSO4·5H2O: 100–300 g/L; H2SO4: 50–150 g/L; Additives | 20–70 °C | Forward 500–1000 A/m², reverse ~3× forward; typical 19 ms forward / 1 ms reverse (adjustable) | Titanium anode coated with modified Ir-Ta mixed metal oxide |
| Circuit Board Gold Plating | Acid/cyanide systems, brighteners & additives; Au: 4–10 g/L; CN-: low concentration | 50–60 °C | 0.1–1.0 ASD; avg. ~0.2 ASD | Platinum + Ir MMO coating; plated platinum thickness 1–10 μm or thicker |
| Other Fields | Acid/cyanide systems, brighteners & additives; Au: 4–10 g/L; CN-: low concentration | 50–60 °C | 0.1–1.0 ASD; avg. ~0.2 ASD | Platinum-plated anode or iridium oxide coating |
Yianteng’s Advantages
We have rich practical experience in developing MMO coated titanium anodes for PCB plating lines, covering DC copper plating, reverse pulse copper plating and gold plating processes.
✅ Our modified iridium-tantalum MMO titanium anodes lower additive consumption and maintain stable anode-cathode spacing throughout the service life. No frequent anode replacement, delivering consistent plating quality.
✅ Customizable coating options: modified Ir-Ta mixed metal oxide coating, platinum / iridium MMO coating, and platinum-plated titanium anodes for gold & precious metal plating.
✅ Our anodes adapt to wide operating windows of temperature and current density, matching vertical continuous plating and pulse plating production lines.
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