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Bipolar Plate for SOEC

Precision-Etching SOEC interconnect plates designed for reliable gas separation, low area-specific resistance and stable operation through demanding high-temperature thermal cycles.

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Bipolar Plate for SOEC

Flow fields,
precisely etched.

±50 μm

Etching precision

Ferritic stainless
/ nickel

Substrate selection

Essential to SOEC stack operation.

 Electrical interconnection and current distribution

Connects adjacent cells and carries current through the stack while limiting resistive loss across repeated interfaces.

 Steam and product-gas management

Etched flow fields distribute steam and reaction gases across the active area and provide controlled routes for product-gas removal.

 Gas separation and structural support

Maintains separation between fuel- and oxygen-side streams while supporting sealing and plate geometry through high-temperature operation.

How the routes compare.

An at-a-glance process comparison for thin SOEC interconnects and evolving flow fields.

Engineering factor

YIANTENG etching

Stamping

Full CNC

Design changes

Update a digital phototool

Rework or replace the hard die

Revise program, fixture and toolpath

Prototype validation

Multiple variants can share one sheet

Production tooling precedes first parts

Each variant needs machining setup

Edge and stress

Burr- and stress-free

Burrs and forming stress may occur

Tool marks; deburring may be needed

Complex flow fields

All channels etched simultaneously

Complexity moves into die design

Features machined path by path

Cost profile

Low tooling; complexity has limited time impact

Higher upfront tooling; strong at stable high volume

Cost rises with setup and toolpath time

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