One plate.
One coordinated route.

±50 μm

Etching precision

50–500 nm

Platinum range

Grade 1 Ti

Titanium substrate

The conductive backbone of the PEM stack.

A bipolar plate does more than connect adjacent cells. It distributes electrical current across the active area while its precision-etched flow field guides water to the reaction zone and removes generated gases.

The same component transfers heat, carries stack compression and supports sealing across repeated cell interfaces. Channel geometry, plate flatness, surface condition and dimensional consistency therefore work together as one stack-performance system.

Current, water, gas, heat and mechanical load—managed through one precisely manufactured plate.

Precision in every channel.

Die-free pattern changes  ·   burr-free thin titanium  ·   prototype-to-batch control

Pt for a more stable electrical interface.

Pretreatment, deposition and thickness control are coordinated for the etched titanium plate.

Stable conductivity

Platinum limits titanium passivation and helps control interfacial resistance under anodic PEM conditions.

Controlled thickness

Project-specific thickness control balances surface protection, electrical performance and platinum use.

Uniform coverage

Controlled deposition supports consistent coverage across channels, lands and the complete active plate area.

Strong adhesion

Cleaning and surface activation promote a firmly bonded layer through handling, assembly and operation.

Develop your next PEM bipolar plate with YIANTENG.